In today''s globalized and highly competitive food industry, packaging is no longer a secondary process added at the end of ...
Researchers at Shanghai University have developed a physics-constrained, data-efficient artificial intelligence framework that enables accurate thermal field inversion in chiplet-based packaging ...
GlobalData on MSN
Post-consumer reality of packaging waste
Once packaging leaves the consumer, it enters fragmented collection and sorting systems where contamination, infrastructure gaps, and market forces determine its fate.
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