EP21FL is a toughened, low-to-moderate viscosity, two-part epoxy. EP21FL two-part epoxy resin works between -60 and 250ºF and resists thermal cycling and shock. Typical viscosity at 25°C is 4,000 cps ...

Reformulated CMR-free epoxy system replicates legacy resin handling and performance properties, proving its capabilities ...

Toughened epoxy system EP21FL has a 4 to 1 mix ratio by weight and cures at ambient temperature. It has a low mixed viscosity of 2,000-4,500 cps. EP21FL has excellent electrical insulation properties ...

Master Bond has introduced EP37-3, a new tough, optically clear, low viscosity epoxy compound for high performance casting, coating, bonding and sealing. Master Bond has successfully introduced EP37-3 ...

The EP3RRLV is a one part epoxy that features low viscosity and rapid curing. It is designed to give superior performance for potting, encapsulation, and underfill applications with curing ...

Shimteq™ RSN ACS01 is a very low viscosity resin that exhibits 50 mPa-s at 25℃ and can be stored at room temperature. As a one-part curable type, it is a thermosetting resin that undergoes a curing ...

A low-viscosity, two-component, transparent epoxy system, called EP30P, is well-suited for high-performance bonding, sealing, coating, encapsulation, and casting. The system has a 4-to-1 mix ratio by ...

The EP21FL two-part epoxy resin system features low to moderate viscosity and suits bonding, potting, coating, and sealing electronic assemblies. The adhesive’s typical viscosity for Part A is 4,000 ...

Master Bond EP114 is a two component, low viscosity, NASA low outgassing rated, heat cured epoxy that can be effectively utilized for underfill, coating, impregnating and porosity sealing applications ...

Presented as a demonstration of responsible ocean sailing, the Greenscow project aims to prove that a racing boat can be both ...