This application note provides guidelines for the handling and assembly of Freescale’s Heat Sink Small Outline Package (HSOP) and Power Quad Flat Package (PQFP) during printed circuit board (PCB) ...
It’ll come as no surprise to any savvy buyer, and certainly not to any design engineer, that each new generation of electronic products packs more performance into a smaller package than the product ...
IXYS Integrated Circuits Division (ICD), Inc. announced the availability of its new CPC1010N, featuring 250 V, single pole, normally open (1-Form-A) Solid State Relay (SSR) with 170 mA load current ...
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