The EP21FL two-part epoxy resin system features low to moderate viscosity and suits bonding, potting, coating, and sealing electronic assemblies. The adhesive’s typical viscosity for Part A is 4,000 ...

Shimteq™ RSN ACS01 is a very low viscosity resin that exhibits 50 mPa-s at 25℃ and can be stored at room temperature. As a one-part curable type, it is a thermosetting resin that undergoes a curing ...

Master Bond has developed a two component, room temperature curing epoxy for bonding, coating, sealing and casting called EP30LV. This compound is easy to apply and exhibits high physical strength ...

Master Bond EP4CL-80Med is a one part, optically clear epoxy developed for use in medical device assembly applications. It withstands repeated sterilization cycles and passes ISO 10993-5 testing for ...

Master Bond EP114 is a two component, low viscosity, NASA low outgassing rated, heat cured epoxy that can be effectively utilised for under fill, coating, impregnating, and porosity sealing ...

Reformulated CMR-free epoxy system replicates legacy resin handling and performance properties, proving its capabilities ...

The new product offers improvements on T-Paste 70-1 such as 20% lower viscosity for easier pumping but with no loss of sag resistance, 20% less back pressure and less drag on application, all while ...