The EP37-3 is an optically clear two component epoxy resin system that features low viscosity and cures at room temperature intended for high performance bonding, casting and coating applications.

Reformulated CMR-free epoxy system replicates legacy resin handling and performance properties, proving its capabilities ...

A low-viscosity, two-component, transparent epoxy system, called EP30P, is well-suited for high-performance bonding, sealing, coating, encapsulation, and casting. The system has a 4-to-1 mix ratio by ...

Shimteq™ RSN ACS01 is a very low viscosity resin that exhibits 50 mPa-s at 25℃ and can be stored at room temperature. As a one-part curable type, it is a thermosetting resin that undergoes a curing ...

Toughened epoxy system EP21FL has a 4 to 1 mix ratio by weight and cures at ambient temperature. It has a low mixed viscosity of 2,000-4,500 cps. EP21FL has excellent electrical insulation properties ...

The EP21FL two-part epoxy resin system features low to moderate viscosity and suits bonding, potting, coating, and sealing electronic assemblies. The adhesive’s typical viscosity for Part A is 4,000 ...

Master Bond’s EP30P two-component epoxy system provides high-performance bonding, sealing, coating, encapsulation, and casting for a variety of substrates. EP30P from Master Bond Inc. is a ...

Master Bond EP114 is a two component, low viscosity, NASA low outgassing rated, heat cured epoxy that can be effectively utilized for underfill, coating, impregnating and porosity sealing applications ...

Master Bond has introduced EP37-3, a new tough, optically clear, low viscosity epoxy compound for high performance casting, coating, bonding and sealing. Master Bond has successfully introduced EP37-3 ...