EP21FL is a toughened, low-to-moderate viscosity, two-part epoxy. EP21FL two-part epoxy resin works between -60 and 250ºF and resists thermal cycling and shock. Typical viscosity at 25°C is 4,000 cps ...

Reformulated CMR-free epoxy system replicates legacy resin handling and performance properties, proving its capabilities ...

Toughened epoxy system EP21FL has a 4 to 1 mix ratio by weight and cures at ambient temperature. It has a low mixed viscosity of 2,000-4,500 cps. EP21FL has excellent electrical insulation properties ...

The EP3RRLV is a one part epoxy that features low viscosity and rapid curing. It is designed to give superior performance for potting, encapsulation, and underfill applications with curing ...

Master Bond has introduced EP37-3, a new tough, optically clear, low viscosity epoxy compound for high performance casting, coating, bonding and sealing. Master Bond has successfully introduced EP37-3 ...

Shimteq™ RSN ACS01 is a very low viscosity resin that exhibits 50 mPa-s at 25℃ and can be stored at room temperature. As a one-part curable type, it is a thermosetting resin that undergoes a curing ...

A low-viscosity, two-component, transparent epoxy system, called EP30P, is well-suited for high-performance bonding, sealing, coating, encapsulation, and casting. The system has a 4-to-1 mix ratio by ...

The EP21FL two-part epoxy resin system features low to moderate viscosity and suits bonding, potting, coating, and sealing electronic assemblies. The adhesive’s typical viscosity for Part A is 4,000 ...

Master Bond EP114 is a two component, low viscosity, NASA low outgassing rated, heat cured epoxy that can be effectively utilized for underfill, coating, impregnating and porosity sealing applications ...

Presented as a demonstration of responsible ocean sailing, the Greenscow project aims to prove that a racing boat can be both ...