LG Electronics is aggressively entering the advanced semiconductor packaging equipment market to meet the surging demand ...

The packaging offers see-through windows, providing transparency to meet consumer demand for clean products. The lightweight, ...

The future of packaging can mean a lot of different things. It can mean new technologies that were just showcased at last ...

BE Semiconductor leads in die-attach tech for AI chips, with strong 2026–2028 growth expected from advanced packaging demand.

Italy is reinforcing its position as a global industrial powerhouse, with exports of packaging and food processing machinery ...

Hanmi is expanding beyond its leading position in high-bandwidth memory (HBM) bonding equipment to enter the system ...

AMIES Technology, a new Chinese lithography equipment manufacturer that showcased its latest chipmaking products at an ...

E&R Engineering's solutions are currently widely adopted in the FCBGA, FCCSP, fan-out, and wafer-level packaging by major ...

Tom Fiennes, sustainability director at Carlsberg Britvic, said: “Every year Carlsberg Britvic produces more than 25 million ...

The Flexible Packaging Association (FPA) released its 2025 Economic Impact of the U.S. Flexible Packaging Industry report, ...

Retailers like EG America, Weigel’s and Kwik Trip have built their own facilities to control the quality and consistency of ...

Conagra Brands and B&G Foods are among the companies spending more time on packaging, which attracts consumer attention and ...