Available in titanium, these platforms give EXALTA’s partners the versatility to address the full spectrum of trauma fixation needs. By achieving EU-MDR certification for both its compression screw ...
Pathanamthitta: Amid the ongoing Crime Branch probe, a total of 14 gold-clad plates were reinstalled on the Dwarapalaka idols at the Sabarimala Ayyappa temple. A team of sculptors led by Mannar ...
Abstract: TSV (through silicon via) is a core technology in 3D IC package. The micro vias can be made by etching or laser drilling. Standard processes for TSV filling begin with seed layer deposition, ...
Abstract: A new principle for the copper removal process, Electro-Chemical-Polishing (ECP), to replace CMP is demonstrated. ECP which leverages electrochemical dissolution of copper has removal rates ...
Future Battery Research Center, Global Institute of Future Technology, Shanghai Jiao Tong University, Shanghai 200240, China Global College, Shanghai Jiao Tong University, Shanghai 200240, China ...