Using the mask-and-plate copper metallization technique, scientists at the German research center fabricated a 1.21 cm² perovskite–silicon tandem solar cell featuring a heterojunction bottom device.
Bump scaling is pushing defect inspection to the limit. What comes next and why it matters.
Abstract: Semiconductor back end of line metallization requires successful integration of barrier metal (BM), copper seed, and copper electroplating, among other processes, in order to carry signals ...
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