MILPITAS, CA – Worldwide silicon wafer shipments rose 3.1% year-on-year in the third quarter to 3,313 million square inches (MSI), according to the SEMI Silicon Manufacturers Group. The increase ...

FRANCE – The EIPC (European Institute for the PCB Community) is seeking abstracts for technical presentations at its Winter Conference, taking place February 3–4, 2026, in Aix-en-Provence, France.

Austin, Texas, November 4th 2025 – High Density Packaging User Group (HDP) is pleased to announce that the European Space Agency (ESA) has become a member.

Austin, Texas, November 3, 2025 – High Density Packaging User Group (HDP) is pleased to announce that the Aoshikang Technology (Hong Kong) Co., Ltd (ASKPCB) has become a member.