The AlphaCHIP1600-IO chiplet has been purpose-built for use in SiPs (System-in-Packages) targeting these next-generation ...

At its Intel Foundry Direct Connect 2025 event in April, Intel announced it is working closely with lead customers on its upcoming 14A process, which is expected to deliver a 15–20% performance gain ...

The chiplet economy rests on three fundamental pillars: deployment, innovation, and manufacturing, each presenting distinct opportunities and challenges.

Arteris recently announced the expansion of its multi-die IP solution. The new upgrades to the company’s network-on-chip (NoC) IP library include the FlexNoC Network-on-Chip with CodaCache Last-Level ...

TOKYO, Japan ― Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced three new high-voltage 650V GaN FETs for AI data centers and server ...

As the race toward 2nm nodes and advanced 3D architectures intensifies, the use of AI for discovery of new materials will be key to achieving a competitive advantage. From mobile processors to memory ...

Synopsys' recent accolades, including the 2025 Frost & Sullivan Technology Innovation Leadership Award, underscore its dominance in AI-driven EDA. Its tools—such as PrimeSim™ , Custom Compiler™, and ...

The company said that using AI accelerates the RF circuit migration process and redesign using Synopsys Custom Compiler with AI-driven analogue design migration tool, ASO.ai, to identify optimal ...

SAN FRANCISCO, Calif. – Addressing the crowd at EE Times' The Future of Chiplets event at DAC, Arm's Eddie Ramirez called on the industry to adopt robust standards and build a true chiplet marketplace ...

By combining ultra-wideband (UWB) positioning with inertial measurement unit (IMU) orientation sensing, MotionEngine Hex delivers true 6-degree-of-freedom (6-DOF) tracking – allowing users to control ...

Researchers are tackling key 6G challenges—from ultra-fast photonic AI for real-time RF processing to novel GaN amplifier behavior and ultra-compact phased-array packaging. Jun.

The MIPI Alliance, an international organization that develops interface specifications for mobile and mobile-influenced industries, today announced the 2024 MIPI Alliance Membership Award recipients, ...