Fan-out Wafer-Level (FOWLP) and Fan-out Panel-Level (FOPLP) semiconductor packaging benefit from plasma treatment, which ensures surfaces are contamination-free to aid the attachment process, ...

Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. A Sigma eliminates ...

STMicroelectronics is introducing a series of GaN flyback converters that simplify designing and building compact, efficient USB-PD chargers, fast battery chargers, and auxiliary ...

Test a 75 watt BGA device with high performance elastomer using a simple swivel lid mechanism. Elastomer connects each signal with -1dB insertion loss at 94GHz frequency ... Test and debug 17x17mm IC, ...

Digital Dynamics Inc. (DDI) introduced a suite of powerful new products and capabilities at SEMICON West in Phoenix, Arizona at booth #1283. DDI's Fusion.IO platform ...

Agileo Automation announced at Booth #877 at SEMICON West 2025 that RECIF Technologies has adopted its combined Speech Scenario and E84 PIO Box solution to test its ... Semiconductor Packaging News is ...

Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Global shipments of silicon wafers are projected to increase 5.4% in 2025 to 12,824 million square inches (MSI) followed by steady growth through 2028 when the market ... To help meet the growing ...

Yole Group's latest report, Status of the Processor Industry 2025, highlights a profound transformation in the global processor market, driven by generative AI and the ... Semiconductor Packaging News ...

Advanced Thermal Solutions, Inc. (ATS) has introduced a series of thermal transfer plates (TTPs) designed for optimizing NVIDIA Jetson Orin Nano, Orin NX, Nano, and Xavier NX ... The Vostok series of ...

The Board of Directors of imec has appointed Patrick Vandenameele as the next Chief Executive Officer. Effective April 1, 2026, he will succeed current CEO Luc Van den hove ... At the 2025 SPIE ...